Lead-Free Electronics
Tin-lead (SnPb) solder historically has been the primary means of interconnection between electronic devices. SERDP and ESTCP projects are improving understanding of the role of Pb in inhibiting whisker growth, developing means for mitigating the risks associated with tin whiskers, and assessing the reliability of Pb-free alloys.
Active Projects List
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Project Title
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Start Date
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Project Information
| Project ID: |
WP-2212
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| Principal Investigator: |
Mr.
David
Hillman,
Rockwell Collins, Inc.
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|
SERDP |
Mar 2012
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Project Information
| Project ID: |
WP-1753
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| Principal Investigator: |
Dr.
Stephan
Meschter,
BAE Systems
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|
SERDP |
Jul 2010
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Project Information
| Project ID: |
WP-1751
|
| Principal Investigator: |
Ms.
Jean
Nielsen,
The Boeing Company
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|
SERDP |
Jun 2010
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Project Information
| Project ID: |
WP-2213
|
| Principal Investigator: |
Dr.
Stephan
Meschter,
BAE Systems
|
|
SERDP |
Mar 2012
|
Project Information
| Project ID: |
WP-1752
|
| Principal Investigator: |
Dr.
Peter
Borgesen,
Binghamton University
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|
SERDP |
Jan 2010
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Project Information
| Project ID: |
WP-1754
|
| Principal Investigator: |
Dr.
Elizabeth
Hoffman,
Savannah River National Laboratory
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|
SERDP |
Feb 2010
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